Surface Mount Capability Surface mount component technology offers a far higher component placement density than the older through-hole technology. With increased circuit miniaturisation and component sizes down to 0.5mm by 0.25mm and still decreasing, surface mount technology offers the electronics designer optimum choice for cost and manufacturing flexibility. 3 SMD Lines (6 Placement Machines) 75K CPH Total Placement Capacity Conceptronics Forced Air Multizone Ovens BTU Paragon 150 ten zone reflow oven for Lead Free process 0402 through to 35mm² component placement 50mm² to 450mm² PCB (small PCBs can be panellised) Micro Ball Grid Array and Fine Pitch QFD Capability Ersa-Scope optical inspection AOI Yestek Scanspectron X-Ray Piergiancomi XBIM100 Ersa IR500 rework station

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